Certified per the IPC J-STD-002 standards to perform Steam Aging and “Dip and Look” solderability testing, let WireMasters verify that the solderability of component leads and termination meets your requirements, and that storage of the material has no adverse effect on the ability to solder components.
Performed at temperatures of 230-240°C, the procedure includes a dipping mechanism, a solder pot, a low power microscope, and, if applicable, steam aging of the test samples. Once testing is completed, full paperwork is provided.
More Testing Solutions
WireMasters has the capability to perform Instron tensile testing, dielectric proof or spark testing, and dielectric withstand, commonly known as hipot testing.
